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Digital ASIC Design GuideFront-End Flow Back-End Flow

Introduction
I/O Level
Bond-Pad Level
- Cadence setup
- Chip-level assembly
Tapeout Level (Initial)
Tapeout Level (Final)

Bond-Pad Level

Bond-Pad Level

📄️Cadence setup

Create a new project library

📄️Chip-level assembly

Create bond-pad level layout

Automatic place and route (APR)

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